Reliabilityof Interconnect Structures
نویسنده
چکیده
8.7.6.1 Electromigration in Encapsulated Metal Line 52 8.7.6.2 Basic Electromigration Characteristics 53 8.7.6.3 Balancing Electron Wind with Stress Gradient 55 8.7.6.4 No-Voiding Condition for Encapsulated Line 56 8.7.6.5 Saturated Void Volume (SVV) 57 8.7.6.6 Experimental Determination of Z ; DaðT T0Þ; B; and D 58 8.7.6.7 No-Extrusion Condition for Encapsulated Line 59 8.7.6.8 The Immortal Interconnect 60 3B2v7:51c GML4:3:1 CSI 08125 Prod:Type: pp:1263ðcol:fig::NILÞ ED:Mahashankar PAGN: MK SCAN:
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